Thermal Management

Thermal Management

Thermal Management
APPLICATION SOLUTION

Thermal Management

High heat-flux scenarios demand more compact and efficient thermal solutions. With microchannels, conformal cooling channels and lattice heat-exchange structures, metal 3D printing brings cooling paths closer to the heat source, improving heat-transfer efficiency and temperature uniformity in limited spaces — ideal for liquid cooling plates, heat exchangers and electronic device heat-dissipation components.

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TYPICAL APPLICATION CASES

Typical Application Cases

Smart Computing Terminal Liquid Cooling Plate

Smart Computing Terminal Liquid Cooling Plate

Material:
AlSi10Mg
Size:
235×160×35(mm)
Usage:
Precision cooling for high-power device chips and PCB heat sources

Structural Features:Mesh channels with 1 mm flow features, 1 mm wall thickness, integrated forming, solves the long cycle, redundancy, low yield and high cost issues of traditional brazing-based liquid cooling plates.

Cabin Phase-Change Thermal Storage Frame

Cabin Phase-Change Thermal Storage Frame

Material:
AlSi10Mg
Size:
270×280×440(mm)
Usage:
High-power component thermal management

Structural Features:Integrated forming of heat-transfer rods and vapor chamber, lattice filling enhances structural stability to meet high-power demands; combined with simulation-optimized lattice gradient design to enhance local stiffness.

TPMS Structural Heat Exchanger

TPMS Structural Heat Exchanger

Material:
AlSi10Mg
Size:
320×210×220(mm)
Usage:
Chemical industry heat exchange

Structural Features:GB/T PM heat exchanger, replaces traditional heat exchange structures, highly integrated structure, compared with traditional twisted-tube heat exchangers, heat exchange efficiency improved by 40%, volume reduced by about 50%.

Chip Liquid Cooling Plate

Chip Liquid Cooling Plate

Material:
CuCrZr
Size:
18×3×16(mm)
Usage:
3C product chip cooling

Structural Features:Multi-objective (flow resistance, cooling uniformity) topology optimization improves liquid cooling plate thermal performance, compared with serpentine channels, flow area increased by 30%, thermal performance improved by 20%.