Semiconductor equipment is the core precision machinery for integrated circuit manufacturing. Metal 3D printing enables integrated forming of complex structures, balancing lightweight, high stiffness, low vibration and efficient thermal management to improve the dynamic performance, positioning accuracy and temperature stability of wafer stages. It also increases material utilization, reduces welding, assembly and machining steps, and lowers manufacturing costs and post-processing requirements such as cleaning.
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Structural Features:TC4 titanium alloy integrated printing, built-in composite channels, weld-free high sealing, ±0.1 °C precision temperature control, corrosion-resistant and low contamination, long life and high reliability.
Structural Features:TC4 integrated printing, multi-outlet distribution channels, precise flow distribution, suitable for centralized semiconductor fluid supply, no solder joints or leaks, even flow distribution, low pressure drop, corrosion-resistant and low outgassing, high reliability.
Structural Features:C-shaped structure densely populated with 0.4 mm micro-holes, integrated mounting and positioning; excellent gas-flow uniformity, corrosion-resistant and low outgassing, improves wafer process yield.
Structural Features:Integrated forming, built-in vacuum channels, lightweight precision wafer clamping, mirror-grade flatness reference; stable clamping without deformation, flatness < 2 μm, excellent thermal uniformity.
